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Engineering | Nanophotonics Lab

Nanomaterial Growth

Semiconductor device processing is carried out in a 4,000 square foot class-100 cleanroom in the Center for Solid State Electronics Research (CSSER).

List of major equipment and systems

  • Tempress 8-stack furnace tubes configured for: wet and dry thermal oxidation; poly-silicon, low temperature oxide and silicon nitride CVD; phosphorus and boron doping; and the annealing of 4” silicon wafers.
  • Heidelberg DWL 66 Mask Making and Optical Direct-Write
  • Karl Suss MJB3 Contact Aligner
  • EVG 620 Front and Backside Aligner
  • JEOL JBX-6000FS/E Electron Beam Lithography System
  • Sloan/Varian 841 Electron Beam Evaporator
  • Torrvac VC-320 Electron Beam Evaporator
  • CHA 600-SE Electron Beam Evaporator
  • CHA 1000-SE E-beam Evaporator
  • Edwards Auto306 Thermal Evaporator
  • MRC-8617 RF Sputter Coater
  • Woollam Ellipsometer WVASE32
  • Rudolph AutoEL II Ellipsometer
  • Dektak IIA Profilometer
  • Filmetrics F20
  • Hitachi S4700 Field Emission Scanning Electron Microscope with Energy Dispersive x-ray Analysis
  • PlasmaQuest 333 RPCVD
  • Tamarack 180M
  • Heat Pulse 610 RTP
  • Jipelec
  • STS ICP Advanced Silicon Etch (ASE)
  • STS ICP All General Etch (AGE)
  • PlasmaLab µ P80 Reactive Ion Etcher
  • Tegal PlasmaLine 411 Plasma Asher
  • EVG620 Mask Aligner
  • EVG520HE Bonder and Semi-automated Hot Embossing